Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...
Abstract: In a wireless communication system, the major concern dwells in factors like increasing the capacity of the system, improving the quality of signal and better coverage without increasing the ...
Description This is a collection MATLAB routines that perform array processing techniques on spatially transformed signals, commonly captured with a spherical microphone array. The routines fall into ...
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