Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise ...

Silicides — alloys of silicon and metals long used in microelectronics — are now being explored again for quantum hardware. But their use faces a critical challenge: achieving phase purity, since some ...

The flexible display's substrate is critical to e-paper's and e-ink's development. Many different types of materials are under investigation, including glass, plastic, polymer films, and metallic ...

Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--TSMC (TSE: 2330, NYSE: TSM) today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform ® (OIP) 3DFabric Alliance at ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Previously, ...

For decades, electronics offered two levels of routing structure to manage signals that originate or terminate in an integrated circuit. Recently, that number has risen to five, and while it adds far ...

Multimaterial molding is supposed to take advantage of the efficiencies in forming two different materials into a single molded part. However, one firm’s planned production of a thermocontroller got ...