Applied Materials introduced semiconductor manufacturing gear designed to create the world's most advanced logic chips. AMAT ...

Chipmaking systems create the smallest atomic-scale features in 3D Gate-All-Around transistorsPrecision™ Selective Nitride PECVD preserves ...

Wall Street is turning its attention to chip equipment makers as spending on new ...

Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera™ system enables higher ...

TL;DR: Intel's new Fab 52 in Chandler, Arizona, produces the most advanced US-made logic chips using the cutting-edge 18A process node, featuring RibbonFET and PowerVia innovations. This facility is ...

To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing systems.

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the ...

In today’s rapidly evolving semiconductor landscape, System-on-Chips (SoCs) are becoming increasingly complex, integrating multiple processing cores, specialized accelerators and vast memory arrays.

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

A convergence of DFT techniques and the proliferation of in-silicon monitors can flag potential failures before they occur.

According to sources familiar with the matter, Samsung is in discussions with the Vietnamese government to establish an IC ...